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Gobi 640 - Thermal Imaging

Gobi-640-GigE

You will enter a new era of easy, fast, and efficient connectivity and system set-up with the ultra-compact Gobi-640-GigE. The powerful GigE Vision interface enables real-time control of the camera parameters and delivers immediate communication with a broad range of vision software packages.

The high performance thermal imaging camera reaches frame rates up to 50Hz at full 640 x 480 image resolution or higher in windowing mode. The detector features a small 17 µm pixel pitch and low 50 mK NETD with germanium window. Together with the on-board image processing algorithms you will have the most versatile R&D tool on the market with excellent image quality, high thermal resolution (0.05 °C) and accurate thermal analysis capabilities. 

The Gobi-640-GigE comes to market as a premium (50 mK NETD) or base (75 mK NETD) version.

Gobi-640-CL

The Gobi-640-CL guaranteees to be the most versatile industrial camera in the market with excellent image quality, high thermal resolution (0.05°C) and accurate thermal analysis capabilities. The advantage of a high quality infrared camera are now combined with the power of a CameraLink interface. 

The Gobi-640-CL is perfectly suited for high speed imaging at full 640 x 480 resolution with high frame rates of 50Hz. The camera comes with an industry standard CameraLink interface for data transfer at full frame rate. In windowing mode the frame rate can even be further increased. This combination makes it ideal for instant, accurate and cost-effective evaluation of your thermal imaging. Using the Gobi-640-CL will bring your measurements to the next level of accuracy!

Xenics Gobi 640 Technical Specifications
Camera ModelGobi-640-CLGobi-640-GigE
Array typeUncooled microbolometer (a-Si)Uncooled microbolometer (a-Si)
Spectral band8 μm to 14 μm8 μm to 14 μm
Resolution640 x 480640 x 480
Pixel pitch17 μm17 μm
Thermal sensitivity (NETD)55 mK @ 30°C with f/1 lens55 mK @ 30°C with f/1 lens
Array cooling Uncooled Uncooled
Pixel operability> 99.5 %> 99.5 %
Optical interface Lens mount supporting multiple lenses Lens mount supporting multiple lenses
Maximum frame rate (full frame)50 Hz50 Hz
Window of interest Minimum size 160 x 120 Minimum size 160 x 120
Integration time range 1 μs - 80 μs 1 μs - 80 μs
Temperature stabilization No thermoelectric cooling required (TEC-less) No thermoelectric cooling required (TEC-less)
Integration type Rolling shutter Rolling shutter
On-board image processing Non-Uniformity Correction, Auto-Offset & Auto-Gain with selectable region of interest, Histogram equalization, XIE Non-Uniformity Correction, Auto-Offset & Auto-Gain with selectable region of interest, Histogram equalization, XIE
ADC16 bit16 bit
Camera controlCameraLink: XSP (Xeneth Serial Protocol) GigE Vision
Image acquisition CameraLink GigE Vision
Trigger Trigger in or out (configurable) Trigger in or out (configurable)
Power consumption < 2 W < 4.5 W
Power supply 12 V 12 V
Shock 40 G, 11 ms according to MIL-STD810G 40 G, 11 ms according to MIL-STD810G
Vibration 5 G (20 Hz to 2000 Hz) according to MIL-STD883J 5 G (20 Hz to 2000 Hz) according to MIL-STD883J
Ambient operating temperature range -40ºC to 60ºC (industrial components) -40ºC to 60ºC (industrial components)
Dimensions (W x H x L mmᵌ) 49 x 49 x 61.35 49 x 49 x 79
Weight camera head < 208 g 263 g
Thermography calibration option 1 -20 °C to 120 °C -20 °C to 120 °C
Thermography calibration option 250 °C to 400 °C50 °C to 400 °C
Thermography calibration option 3 300 °C to 1200 °C 300 °C to 1200 °C
Thermography calibration option 4 1000 °C to 2000 °C 1000 °C to 2000 °C